• DocumentCode
    1692747
  • Title

    Coil-on-chip: Design of integrated coils for inductive telemetry system

  • Author

    Rey, Jorge Mario Garzón ; Palechor, Jesús Andrés ; Ariza, Luis Felipe ; Rozo, Antonio García ; Segura-Quijano, Fredy

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. de los Andes, Bogota, Colombia
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper evaluates considerations to design integrated coils for telemetry applications. Usually inductive links have a low efficiency for small sizes coils, because they have low coupling coefficient (k → 0.1) and low quality factor due to the CMOS metals. However, the geometry of the coil can significantly improve the coupling and the transmitted energy. Some studies use generalizations to make the calculation of self-resonant frequency, which must be over the working resonance frequency. These generalizations normally presents a self-resonance frequency below the experimental frequency, that mean a design with fewer turns than are possible (fewer induced magnetic field). This paper evaluates a geometry-based method to calculate the self-resonant frequency to design integrated coils, in order to maximize area using as many turns as possible (to increase induced magnetic field). This geometry-based method can be used with integrated coils with and without dielectric oxide between the coil and the substrate. It also generates a circuital model for a better estimation of self-resonance frequency.
  • Keywords
    CMOS integrated circuits; coils; frequency estimation; geometry; integrated circuit design; telemetry; CMOS metal; coil geometry-based method; coil-on-chip; coupling coefficient; dielectric oxide; inductive telemetry system; integrated coil design; quality factor; self-resonance frequency estimation; self-resonant frequency calculation; Capacitance; Coils; Inductance; Integrated circuit modeling; Radio frequency; Substrates; Telemetry; Integrated coils; inductive telemetry; wireless powering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (LASCAS), 2012 IEEE Third Latin American Symposium on
  • Conference_Location
    Playa del Carmen
  • Print_ISBN
    978-1-4673-1207-3
  • Type

    conf

  • DOI
    10.1109/LASCAS.2012.6180358
  • Filename
    6180358