DocumentCode
1692780
Title
Effect of oxygen annealing temperature on AlGaN/GaN HEMTs
Author
Seok, Ogyun ; Kim, Young-Shil ; Lim, Jiyong ; Han, Min-Koo
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., Seoul, South Korea
fYear
2011
Firstpage
235
Lastpage
238
Abstract
We have investigated an effect of oxygen annealing temperature on the leakage current and breakdown voltage of AlGaN/GaN HEMTs. The breakdown voltage of 830 V and a low drain leakage current of 1.2 nA/mm at VDS= 50 V and VGS= -5 V are exhibited by employing oxygen annealing at 550°C. The blocking characteristics are improved with increasing annealing temperature up to 550°C due to high density of deep traps generated by oxygen annealing. However, the blocking characteristics of the annealed device were degraded when the annealing temperature exceeds 550°C due to thermal damage on the surface of AlGaN/GaN HEMTs.
Keywords
III-V semiconductors; electric breakdown; high electron mobility transistors; leakage currents; AlGaN-GaN; HEMT; blocking characteristics; breakdown voltage; leakage current; oxygen annealing temperature; temperature 550 C; thermal damage; voltage -5 V; voltage 50 V; voltage 830 V; Aluminum gallium nitride; Annealing; Gallium nitride; HEMTs; Leakage current; Logic gates; MODFETs;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
Conference_Location
San Diego, CA
ISSN
1943-653X
Print_ISBN
978-1-4244-8425-6
Type
conf
DOI
10.1109/ISPSD.2011.5890834
Filename
5890834
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