Title :
Thermal impedance spectroscopy of power modules during power cycling
Author :
Henlser, Alexander ; Wingert, Daniel ; Herold, Christian ; Lutz, Josef ; Thoben, Markus
Author_Institution :
Chemnitz Univ. of Technol., Chemnitz, Germany
Abstract :
The presented thermal impedance spectroscopy of power modules simplifies significantly the failure analysis of power modules. It enables online observation of degradation within the cooling path with detailed information about failure mechanisms. The degradation of certain layer within the power module is detected by observation of Zth parameters. Several tests results are compared with analysis of the scanning acoustic microscope.
Keywords :
acoustic microscopes; cooling; failure analysis; power semiconductor devices; cooling path; failure analysis; failure mechanisms; power cycling; power modules; scanning acoustic microscope; thermal impedance spectroscopy; Degradation; Impedance; Junctions; Multichip modules; Temperature measurement; Thermal analysis; Thermal resistance;
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-8425-6
DOI :
10.1109/ISPSD.2011.5890841
