Investigation on wirebond-less power module structure with high-density packaging and high reliability

A newly developed module with wirebond-less structure is investigated. This structure has multi-pin attached interconnection structure implanted into power circuit board with connecting line between chips and other elements inside the power module. Additionally, heat-spreader-like copper blocks bonded to ceramic insulated substrates performing high thermal conductivity, enable to realize high current capability operations effectively. Moreover, full molded resin package performs higher reliability comparing with the conventional module, shows the package structure is one of the potential candidates of power module for the high power applications including Wide Band Gap (WBG) devices.