Packaging trends in the 90´s

It is pointed out that, as the level of integration increases and system performance rapidly approaches cycle times where packaging delays become important gates, multi-chip modules (MCMs) will become the necessary packaging solution for a growing number of manufacturers. The authors address the need for multi-chip modules, volume projections, and a categorization proposal that can be used to help set the packaging manufacturers´ strategic direction that will be consistent with their customers´ future direction. It is concluded that, for moderately complex systems, MCMs can provide the manufacturer with a substantial improvement in package density and alleviate complexity at the second level package. MCMs can be divided into categories that define module complexity and I/O density for PCs, workstations and intermediate level computer systems. This should allow the manufacturer to plan for the type of module that best suits the manufacturer´s needs