• DocumentCode
    1693048
  • Title

    Modeling and analysis of dual-arm cluster tools for wafer fabrication with revisiting

  • Author

    Qiao, Yan ; Wu, NaiQi ; Zhou, MengChu

  • Author_Institution
    Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
  • fYear
    2011
  • Firstpage
    90
  • Lastpage
    95
  • Abstract
    Some wafer fabrication processes are repeated processes, e.g. atomic layer deposition (ALD) process. For such processes, the wafers need to visit some processing modules for a number of times, which complicates the cycle time analysis. This paper studies the cycle time analysis problem for such processes. With a Petri net model, it is found that such processes contain local cycles involving only the revisiting PMs and global cycles involving both revisiting and non-revisiting PMs. The process switches between these two types of cycles such that the process never reaches a steady state. Based on this finding, the mechanism underlying such processes is revealed and analytical expressions are given for the calculation of their cycle time. Illustrative examples are presented to show the application of the proposed approach.
  • Keywords
    Petri nets; industrial manipulators; machine tools; semiconductor device manufacture; semiconductor industry; Petri net model; atomic layer deposition process; cycle time analysis; dual-arm cluster tool; processing module revisiting; repeated process; wafer fabrication process; Analytical models; Fabrication; Load modeling; Robots; Schedules; Semiconductor device modeling; System recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering (CASE), 2011 IEEE Conference on
  • Conference_Location
    Trieste
  • ISSN
    2161-8070
  • Print_ISBN
    978-1-4577-1730-7
  • Electronic_ISBN
    2161-8070
  • Type

    conf

  • DOI
    10.1109/CASE.2011.6042403
  • Filename
    6042403