DocumentCode
1693048
Title
Modeling and analysis of dual-arm cluster tools for wafer fabrication with revisiting
Author
Qiao, Yan ; Wu, NaiQi ; Zhou, MengChu
Author_Institution
Dept. of Ind. Eng., Guangdong Univ. of Technol., Guangzhou, China
fYear
2011
Firstpage
90
Lastpage
95
Abstract
Some wafer fabrication processes are repeated processes, e.g. atomic layer deposition (ALD) process. For such processes, the wafers need to visit some processing modules for a number of times, which complicates the cycle time analysis. This paper studies the cycle time analysis problem for such processes. With a Petri net model, it is found that such processes contain local cycles involving only the revisiting PMs and global cycles involving both revisiting and non-revisiting PMs. The process switches between these two types of cycles such that the process never reaches a steady state. Based on this finding, the mechanism underlying such processes is revealed and analytical expressions are given for the calculation of their cycle time. Illustrative examples are presented to show the application of the proposed approach.
Keywords
Petri nets; industrial manipulators; machine tools; semiconductor device manufacture; semiconductor industry; Petri net model; atomic layer deposition process; cycle time analysis; dual-arm cluster tool; processing module revisiting; repeated process; wafer fabrication process; Analytical models; Fabrication; Load modeling; Robots; Schedules; Semiconductor device modeling; System recovery;
fLanguage
English
Publisher
ieee
Conference_Titel
Automation Science and Engineering (CASE), 2011 IEEE Conference on
Conference_Location
Trieste
ISSN
2161-8070
Print_ISBN
978-1-4577-1730-7
Electronic_ISBN
2161-8070
Type
conf
DOI
10.1109/CASE.2011.6042403
Filename
6042403
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