DocumentCode :
1693161
Title :
Modelling of resolution enhancement processes in lithography
Author :
Arshak, K.I. ; McDonagh, D. ; Arshak, A. ; Mathur, B.P.
Author_Institution :
Dept. of Electron. & Comput. Eng., Limerick Univ., Ireland
Volume :
1
fYear :
1995
Firstpage :
309
Abstract :
This paper describes the modelling and simulation of two resolution enhancement techniques in lithography: 1) phase shift mask (PSM) technology and 2) top surface imaging (TSI) with silylation and dry development. The effect of the duty ratio on the image contrast is computed. Simulated one and two dimensional rim shifters and attenuated PSMs are presented. The effect of the aerial image on the silylation profile for the top imaging processes, DESIRE and PRIME, is also presented. The effect of the first etch step on the final resist profiles is examined. The partial pressure and the presence of magnetic fields are also considered
Keywords :
lithography; phase shifting masks; semiconductor process modelling; DESIRE; PRIME; aerial image; attenuated PSM; dry development; duty ratio; first etch step; image contrast; lithography; magnetic fields; modelling; partial pressure; phase shift mask technology; resist profiles; resolution enhancement processes; silylation; silylation profile; simulation; top imaging processes; top surface imaging; two dimensional rim shifters; Computational modeling; Dry etching; Electron optics; Image resolution; Lithography; Magnetic fields; Optical attenuators; Optical devices; Optical imaging; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 1995. Proceedings., 1995 20th International Conference on
Conference_Location :
Nis
Print_ISBN :
0-7803-2786-1
Type :
conf
DOI :
10.1109/ICMEL.1995.500886
Filename :
500886
Link To Document :
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