Title :
Table of contents
Abstract :
The following topics are dealt with: Yield Enhancement; Advanced Metrology; 3D/TSV; Advanced Process Control; Factory Optimization; Defect Inspection; Equipment Reliability and Productivity Enhancement; Contamination Free Manufacturing; Data and Yield Management; Discrete Power Devices/Emerging Technologies; Advanced Patterning/DFM; and Advanced Equipment and Materials.
Keywords :
inspection; integrated circuit yield; process control; semiconductor device manufacture; three-dimensional integrated circuits; 3D TSV; advanced equipment; advanced materials; advanced metrology; advanced patterning; advanced process control; contamination free manufacturing; data management; defect inspection; discrete power devices; equipment reliability; factory optimization; productivity enhancement; yield enhancement; yield management;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6846944
