A novel power system in package with 3D chip on chip interconnections of the power transistor and its gate driver

Author

Timothé, Simonot ; Nicolas, Rouger ; Jean-Christophe, Crebier ; Victor, Gaude ; Pheng, Irène

Author_Institution

Grenoble Electr. Eng. Lab., Grenoble Univ., St. Martin d´´Hères, France

fYear

2011

Firstpage

328

Lastpage

331

Abstract

Currently, most industrial power modules, even IPEMs (Intelligent Power Electronics Modules), are interconnected in a planar way, and interconnections are made with bonding wires. This paper presents a three dimensional interconnection solution based on the idea to flip chip the gate driver directly on the surface of the power device, simplifying and optimizing the packaging and the interconnections among the two devices and improving the overall performances. Various approaches and interconnection solutions will be presented in this paper, and the advantages of the chosen approach will be discussed. Then the technological process for the realization of the interconnections will be explained, and practical realizations will be shown.

Keywords

chip scale packaging; driver circuits; flip-chip devices; integrated circuit interconnections; power electronics; power transistors; 3D chip; IPEM; bonding wires; chip interconnections; flip chip; gate driver; industrial power modules; intelligent power electronics modules; package; planar interconnections; power device; power system; power transistor; Assembly; Copper; Driver circuits; Flip chip; Gold; Logic gates; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and ICs (ISPSD), 2011 IEEE 23rd International Symposium on

Conference_Location

San Diego, CA

ISSN

1943-653X

Print_ISBN

978-1-4244-8425-6

Type

conf

DOI

10.1109/ISPSD.2011.5890857

Filename

5890857