DocumentCode
1693338
Title
Robust-design of a metallization process for ceramic substrates
Author
Law, H.H. ; Mattoe, C.A. ; Thomson, J., Jr. ; Smith, T.E. ; Zappula, R.
Author_Institution
AT&T Bell Lab., Murray Hill, NJ, USA
fYear
1991
Firstpage
379
Lastpage
382
Abstract
The electroless nickel deposition process on ceramic substrates was optimized using a Taguchi-based robust-design method. The plating parameter settings were obtained in only 27 experiments. The savings in experiments is significant when compared to a full factorial design of 486 runs. The yield of completely metallized substrate was increased substantially. Under the optimal conditions, a 100% yield was obtained in the confirmation run of 80 ceramic samples
Keywords
ceramics; electroless deposition; integrated circuit technology; metallisation; nickel; substrates; Taguchi-based robust-design method; ceramic substrates; electroless Ni deposition process; metallization process; metallized substrate; plating parameter settings; Ceramics; Cleaning; Design methodology; Electronic components; Manufacturing; Metallization; Nickel; Palladium; Robustness; Water pollution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-0155-2
Type
conf
DOI
10.1109/IEMT.1991.279819
Filename
279819
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