• DocumentCode
    1693928
  • Title

    Proportional hazard model with ℓ1 Penalization applied to Predictive Maintenance in semiconductor manufacturing

  • Author

    Pampuri, Simone ; Schirru, Andrea ; De Luca, Cristina ; De Nicolao, Giuseppe

  • Author_Institution
    Univ. of Pavia, Pavia, Italy
  • fYear
    2011
  • Firstpage
    250
  • Lastpage
    255
  • Abstract
    The present paper is motivated by the application of Predictive Maintenance (PM) techniques in the semiconductor manufacturing environment: such techniques are able, using process data, to make reliable predictions of residual equipment lifetime. The employment of PM yields positive fallouts on the productive process in form of unscheduled downtime reduction, increased spare parts availability and improved overall production quality. One of the main challenges in PM modeling regards the data-driven assessment of relevant process variables when insufficient expert knowledge is available. In this paper, survival models theory is employed jointly with ℓ1 penalization techniques: this allows to obtain sparse models able to select the meaningful process variables and simultaneously predict the remaining lifetime of an equipment. Additionally, frailty modeling techniques are employed to concurrently handle several productive equipments of the same type, exploiting their similarities to increase prediction accuracy. The proposed methodology is validated, illustrating promising results, by means of a semiconductor manufacturing dataset.
  • Keywords
    manufacturing industries; preventive maintenance; semiconductor industry; ℓ1 penalization techniques; data-driven assessment; frailty modeling techniques; predictive maintenance; proportional hazard model; semiconductor manufacturing environment; survival models theory; unscheduled downtime reduction; Hazards; Manufacturing; Predictive maintenance; Predictive models; Semiconductor device modeling; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering (CASE), 2011 IEEE Conference on
  • Conference_Location
    Trieste
  • ISSN
    2161-8070
  • Print_ISBN
    978-1-4577-1730-7
  • Electronic_ISBN
    2161-8070
  • Type

    conf

  • DOI
    10.1109/CASE.2011.6042436
  • Filename
    6042436