DocumentCode
169398
Title
Chamber matching across multiple dimensions utilizing Predictive Maintenance, Equipment Health Monitoring, Virtual Metrology and Run-To-Run control
Author
Moyne, James ; Yedatore, Manjunath ; Iskandar, Jimmy ; Hawkins, Parris ; Scoville, John
Author_Institution
Appl. Mater.-Appl. Global Services, Santa Clara, CA, USA
fYear
2014
fDate
19-21 May 2014
Firstpage
86
Lastpage
91
Abstract
Matching tools running identical processes is particularly critical for users migrating to more advanced nodes. Sustaining a fleet of tools to a matched state can reduce yield losses and yield variability, allow for greater routing flexibility in the fab, identify and control process inefficiencies, and reduce time for root cause analysis of yield issues. The matching process is multi-dimensional, covering hardware, software, tool sensors, process, metrology, maintenance and end of line electrical test and yield. The current state-of-the-art of chamber matching during production is chamber variance detection and reporting. A solution that provides a true active matching capability has been developed as part of a multi-dimensional chamber matching approach. It leverages a number of Advanced Process Control (APC) techniques collectively. Specifically Equipment Health Monitoring (EHM) is used for health monitoring during processing and for fingerprinting during maintenance recovery, Predictive Maintenance (PdM) is used to predict a consistent downtime state, and Virtual Metrology (VM) along with Run-to-Run (R2R) control is used to expedite maintenance recovery.
Keywords
computerised instrumentation; integrated circuit yield; preventive maintenance; process control; tools; advanced process control technique; chamber matching; chamber variance detection; equipment health monitoring; line electrical test; maintenance recovery; matching tools; predictive maintenance; routing flexibility; run-to-run control; virtual metrology; Maintenance engineering; Metrology; Monitoring; Process control; Production; Software; Tuning; Chamber Matching; Equipment Health Monitoring; Mean-time-to-repair; Predictive Maintenance; Virtual Metrology; mean-time-between-interrupts;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2014.6846983
Filename
6846983
Link To Document