DocumentCode :
169398
Title :
Chamber matching across multiple dimensions utilizing Predictive Maintenance, Equipment Health Monitoring, Virtual Metrology and Run-To-Run control
Author :
Moyne, James ; Yedatore, Manjunath ; Iskandar, Jimmy ; Hawkins, Parris ; Scoville, John
Author_Institution :
Appl. Mater.-Appl. Global Services, Santa Clara, CA, USA
fYear :
2014
fDate :
19-21 May 2014
Firstpage :
86
Lastpage :
91
Abstract :
Matching tools running identical processes is particularly critical for users migrating to more advanced nodes. Sustaining a fleet of tools to a matched state can reduce yield losses and yield variability, allow for greater routing flexibility in the fab, identify and control process inefficiencies, and reduce time for root cause analysis of yield issues. The matching process is multi-dimensional, covering hardware, software, tool sensors, process, metrology, maintenance and end of line electrical test and yield. The current state-of-the-art of chamber matching during production is chamber variance detection and reporting. A solution that provides a true active matching capability has been developed as part of a multi-dimensional chamber matching approach. It leverages a number of Advanced Process Control (APC) techniques collectively. Specifically Equipment Health Monitoring (EHM) is used for health monitoring during processing and for fingerprinting during maintenance recovery, Predictive Maintenance (PdM) is used to predict a consistent downtime state, and Virtual Metrology (VM) along with Run-to-Run (R2R) control is used to expedite maintenance recovery.
Keywords :
computerised instrumentation; integrated circuit yield; preventive maintenance; process control; tools; advanced process control technique; chamber matching; chamber variance detection; equipment health monitoring; line electrical test; maintenance recovery; matching tools; predictive maintenance; routing flexibility; run-to-run control; virtual metrology; Maintenance engineering; Metrology; Monitoring; Process control; Production; Software; Tuning; Chamber Matching; Equipment Health Monitoring; Mean-time-to-repair; Predictive Maintenance; Virtual Metrology; mean-time-between-interrupts;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
Type :
conf
DOI :
10.1109/ASMC.2014.6846983
Filename :
6846983
Link To Document :
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