DocumentCode
1694082
Title
PWB stability analysis under in-plane forces
Author
He, Xiaoling ; Fulton, Robert E.
Author_Institution
Agere Syst., Orlando, FL, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
467
Lastpage
472
Abstract
The response of a printed wiring board (PWB) in nonlinear dynamics analysis is analyzed with consideration of the in-plane forces. Nonlinear response behavior of a thin laminated PWB is characterized under both in-plane and transverse loading conditions. In-plane forces induced by the incompatible thermal expansion between laminae of the PWB are discussed. Loading effects on the post-buckling behavior and the dynamic instability are studied. Differences in the dynamic stability under nonlinear vibration and the critical load for buckling under static load are compared. The analytical results apply to the general microstructures in thin laminates for their oscillation stability in nonlinear dynamic response. In addition, the PWB stress distribution is given in analytical form for an assessment of its reliability. The PWB failure mechanism is emphasized in the light of the stress-induced defect formation at the sub-micron scale.
Keywords
buckling; circuit reliability; dynamic response; failure analysis; laminates; mechanical stability; printed circuits; thermal expansion; vibrations; PWB failure mechanism; PWB stability analysis; critical load for buckling; dynamic instability; in-plane forces; in-plane loading conditions; incompatible thermal expansion; nonlinear dynamics analysis; nonlinear response behavior; nonlinear vibration; oscillation stability; post-buckling behavior; printed wiring board response; reliability; stress distribution; stress-induced defect formation; thin laminated PWB; thin laminates; transverse loading conditions; Laminates; Microstructure; Nonlinear equations; Stability analysis; Temperature; Thermal expansion; Thermal force; Thermal loading; Thermal stresses; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008137
Filename
1008137
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