Title :
Screen printed flexible pressure sensors skin
Author :
Khan, Sharifullah ; Lorenzelli, Leandro ; Dahiya, Ravinder S.
Author_Institution :
Univ. of Trento, Trento, Italy
Abstract :
This paper presents all screen printed flexible pressure sensors arrays with Polyvinylidene Fluoride-Trifluoroethylene P(VDF-TrFE) sandwiched between patterned metal layers. Whilst bottom electrodes and P(VDF-TrFE) are printed on a 25 μm thick polyamide (PI) substrate, the top electrodes with force concentrator posts on backside are printed on a separate polyethylene terephthalate (PET) substrate and the two are then adhered with good alignment. Each sensor module consists of 4×4 sensors array, with each sensor having 1×1 mm2 sensitive area, and interconnection lines for expandability of the cells. Capacitance-voltage analysis at varying frequency and piezoelectric response of the sensor is presented. Whole package of foldable pressure sensor realized is completely developed by screen printing technology and is targeted towards realizing low-cost electronic skin. The sensors arrays have also been compared with similar sensors structures that were realized with spin coating.
Keywords :
electrodes; flexible electronics; integrated circuit interconnections; pressure sensors; sensor arrays; spin coating; thick films; P(VDF-TrFE); PETsubstrate; PI substrate; bottom electrodes; capacitance-voltage analysis; foldable pressure sensor; interconnection lines; low-cost electronic skin; patterned metal layers; piezoelectric response; polyamide substrate; polyethylene terephthalate substrate; polyvinylidene fluoride-trifluoroethylene; screen printed flexible pressure sensors skin; screen printing technology; sensor array; size 1 mm; size 25 mum; spin coating; varying frequency; Electrodes; Force; Humidity; Printing; Sensor arrays; Substrates; Flexible Sensors; Piezoelectric; Polyvinylidene Fluoroethylene (PVDF-TrFE); Screen Printing; Spin Coating;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6847002