Title :
Addressing thin film thickness metrology challenges of 14nm BEOL layers
Author :
Zhiming Jiang ; Haupt, Randy ; Ygartua, Carlos ; Vaid, Alok ; Lenahan, Michael ; Seshachalam, V.
Author_Institution :
KLA-Tencor Corp., Milpitas, CA, USA
Abstract :
In this paper we discuss the impact of these two effects on the film thickness measurement and describe our approach to develop a film stack model and recipe which accounts for the underlying stack as well as Chemical Mechanical Planarization (CMP) variation. We also describe the verification and production implementation of this model using mass production data.
Keywords :
chemical mechanical polishing; mass production; planarisation; thickness measurement; BEOL layers; CMP; chemical mechanical planarization; film stack; mass production data; production implementation; size 14 nm; thin film thickness metrology; underlying stack; verification implementation; Dispersion; Films; Fitting; Metals; Semiconductor device measurement; Semiconductor device modeling; Thickness measurement; Chemical Mechanical Planarization (CMP); Film stack; Spectroscopic Ellipsometer;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2014.6847016
