Packaging the Itanium® microprocessor

Discusses the thermal, mechanical, and electrical requirements and design solutions for the Itanium® processor cartridge. High power dissipation level of the cartridge, with up to five active dice, poses significant thermal design challenges. The thermal solution employed is presented and the design of heat pipe lid and effectiveness of the thermal interface material is discussed. The thermal behavior of the cartridge is analyzed using numerical analysis and experimental validations. The mechanical section discusses the pieces of the cartridge enclosure designed to ensure proper bond line thickness (BLT) of the thermal interface between the die and the heat pipe lid pedestals, engagement of the cartridge with enabling components, and protection against shock and vibration under various environmental conditions. Demanding power requirements by the Itanium® processor cartridge and the high-speed buses used for communication between the CPU and other components resulted in challenging package and substrate design. High-speed layout techniques were employed to meet the electrical performance requirements.