• DocumentCode
    169474
  • Title

    Extending dry pump reliability on high-k ALD furnaces

  • Author

    Nishimura, Kosuke ; Boger, Maiku ; Ito, Kei

  • Author_Institution
    Edwards Ltd., Yachiyo, Japan
  • fYear
    2014
  • fDate
    19-21 May 2014
  • Firstpage
    306
  • Lastpage
    309
  • Abstract
    The industry, today, makes use of high-k dielectric films deposited using ALD. Early introduction of these processes into high volume manufacture identified dry pump reliability to be a key concern. Careful investigation of the exchanged pumps and analysis of the issues allowed for better understanding of the likely failure mechanisms. Changing the pump mechanism from that used in the original pumps resulted in extending the service interval four to six times that originally experienced. More than temperature changes or purge adjustments, a fundamental change to the pump structure yielded the most positive results.
  • Keywords
    atomic layer deposition; batch processing (industrial); electronic equipment manufacture; high-k dielectric thin films; semiconductor device reliability; semiconductor technology; vacuum pumps; atomic layer deposition; dry pump reliability; high volume manufacture; high-k ALD furnaces; high-k dielectric films; Furnaces; Gases; High K dielectric materials; Liquids; Metals; Powders; Rotors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2014.6847026
  • Filename
    6847026