Title :
A novel integrated passive substrate fabricated directly on an organic laminate for RF applications
Author :
Okubora, Akihiko ; Ogawa, Tsuyoshi ; Hirabayashi, Takayuki ; Kosemura, Takahiko ; Ogino, Tetsuya ; Nakayama, Hirokazu ; Oya, Youichi ; Nishitani, Yuji ; Asami, Yukio
Author_Institution :
Semicond. Network Co., Sony Corp., Kanagawa, Japan
fDate :
6/24/1905 12:00:00 AM
Abstract :
We report here a novel integrated passive substrate using thin film technology directly fabricated on multi-layer laminates. The thin film part consists of electroplated Cu interconnect and low-loss BCB dielectric fabricated on flattened PPE laminated substrate. According to microstrip-based approaches, inductor, capacitor and resistor structures were optimized and very high-Q inductors and capacitors were obtained. The separating routing design scheme between the thin film part and the multi-layer laminate part makes the RF-module compact and shows superior isolation performance.
Keywords :
Q-factor; electroplating; inductors; integrated circuit interconnections; integrated circuit packaging; laminates; microstrip circuits; microwave devices; network routing; thin film capacitors; thin film devices; thin film resistors; RF applications; RF module; capacitor structures; direct fabrication; electroplated Cu interconnect; flattened PPE laminated substrate; high-Q capacitors; high-Q inductors; inductor structures; integrated passive substrate; isolation performance; low-loss BCB dielectric; microstrip-based approach; multi-layer laminates; optimization; organic laminate; resistor structures; separating routing design scheme; thin film technology; Capacitors; Costs; Dielectric substrates; Dielectric thin films; Laminates; Packaging; Radio frequency; Resistors; Semiconductor thin films; Thin film inductors;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008169
