DocumentCode
1695071
Title
Installation and testing of laser projection imaging system for fine-line PCB production
Author
Danzer, J. ; Zemel, M. ; Nunes, C.
Author_Institution
Rockwelll Collins, Cedar Rapids, IA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
681
Lastpage
685
Abstract
A new class of laser projection imaging (LPI) systems has been developed for cost-effective production of high-performance, high-volume printed circuit boards and other microelectronic systems fabricated on large substrates. The systems enable high-resolution exposure and precise alignment at high throughputs. Exposures are made using conventional, dry-film and liquid photoresists and conventional, mylar or glass masks. In October 2000, an LPI system was installed at Rockwell Collins Printed Circuits (CPC). We review the criteria for selecting the LPI system, the design and specifications of the system, the installation and calibration of the equipment, and the initial results from performance testing in a manufacturing environment. There were three primary drivers that led CPC to install the Anvik LPI system. The first was the desire to improve yields through the benefits of non-contact, projection exposure. The second was the desire to improve throughput and reduce operator fatigue (from running manual contact printers). The final rationale was based on the need for higher resolution imaging.
Keywords
calibration; laser beam applications; masks; optical projectors; photoresists; printed circuit manufacture; Anvik; Rockwell Collins Printed Circuits; calibration; fine-line PCB production; high-resolution exposure; laser projection imaging system; manufacturing environment; masks; operator fatigue; photoresists; projection exposure; throughputs; yields; Calibration; Circuit testing; Glass; High-resolution imaging; Microelectronics; Printed circuits; Production systems; Resists; System testing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008171
Filename
1008171
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