• DocumentCode
    1695071
  • Title

    Installation and testing of laser projection imaging system for fine-line PCB production

  • Author

    Danzer, J. ; Zemel, M. ; Nunes, C.

  • Author_Institution
    Rockwelll Collins, Cedar Rapids, IA, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    681
  • Lastpage
    685
  • Abstract
    A new class of laser projection imaging (LPI) systems has been developed for cost-effective production of high-performance, high-volume printed circuit boards and other microelectronic systems fabricated on large substrates. The systems enable high-resolution exposure and precise alignment at high throughputs. Exposures are made using conventional, dry-film and liquid photoresists and conventional, mylar or glass masks. In October 2000, an LPI system was installed at Rockwell Collins Printed Circuits (CPC). We review the criteria for selecting the LPI system, the design and specifications of the system, the installation and calibration of the equipment, and the initial results from performance testing in a manufacturing environment. There were three primary drivers that led CPC to install the Anvik LPI system. The first was the desire to improve yields through the benefits of non-contact, projection exposure. The second was the desire to improve throughput and reduce operator fatigue (from running manual contact printers). The final rationale was based on the need for higher resolution imaging.
  • Keywords
    calibration; laser beam applications; masks; optical projectors; photoresists; printed circuit manufacture; Anvik; Rockwell Collins Printed Circuits; calibration; fine-line PCB production; high-resolution exposure; laser projection imaging system; manufacturing environment; masks; operator fatigue; photoresists; projection exposure; throughputs; yields; Calibration; Circuit testing; Glass; High-resolution imaging; Microelectronics; Printed circuits; Production systems; Resists; System testing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008171
  • Filename
    1008171