• DocumentCode
    16956
  • Title

    A Novel Planar Impedance-Transforming Tight-Coupling Coupler and Its Applications to Microstrip Baluns

  • Author

    Yongle Wu ; Qiang Liu ; Sai-Wing Leung ; Yuanan Liu ; Quan Xue

  • Author_Institution
    Beijing Key Lab. of Work Safety Intell. Monitoring, Beijing Univ. of Posts & Telecommun., Beijing, China
  • Volume
    4
  • Issue
    9
  • fYear
    2014
  • fDate
    Sept. 2014
  • Firstpage
    1480
  • Lastpage
    1488
  • Abstract
    A novel impedance-transforming coupled-line coupler with strong coupling coefficient is proposed in this paper. Its analytical design methodology and applications to microstrip baluns are presented. For demonstration purposes, four numerical examples of this proposed impedance-transforming coupler with different terminated impedances are given. The calculated results show that this proposed coupler not only matches two different groups of terminated impedances but also covers the total power-dividing ratio range from 0 dB to infinite value. The measured results of the fabricated coupler verify the proposed design approach. Finally, this kind of coupler is used to construct a novel planar microstrip balun. This proposed balun has many advantages including planar structure without any via holes, strong coupled lines, and wide operation bandwidth. The experimental results of this proposed balun operating at approximately 2 GHz demonstrated these proposed ideas.
  • Keywords
    baluns; coupled transmission lines; microstrip couplers; analytical design methodology; design approach; impedance-transforming coupled-line coupler; planar impedance-transforming tight-coupling coupler; planar microstrip balun; planar structure; power-dividing ratio; strong coupling coefficient; terminated impedances; Couplers; Couplings; Impedance; Impedance matching; Microstrip; Prototypes; Scattering parameters; Balun; coupled-line; impedance transforming; microstrip coupler; tight coupling;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2339232
  • Filename
    6873251