Automated opto-electronic packaging for 10 Gb/s transponders

Author

Verdiell, Jean-Marc ; Kohler, Robert ; Epitaux, Marc ; Finot, Marc ; Kirkpatrick, Peter ; Lake, Rick ; Colin, Sylvain ; Mader, Tom ; Bennett, Jeff ; Yao, Jason ; Zbinden, Eric ; Buchheit, Steve ; Walker, Jay

Author_Institution

Opt. Product Div., Intel Corp., Newark, CA, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

808

Lastpage

810

Abstract

Integrated transponders are quickly displacing discrete module implementation in many 10 Gb/s line card designs. The emergence of the 10 Gigabit Ethernet (10 GbE) standard had placed higher demands on manufacturing scalability to meet the volume requirements of this application. To meet these challenges, we have developed a novel automated manufacturing implementation of small form factor, high performance, and highly integrated uncooled optics. We describe the design and automated manufacturing of such modules, present their performance, and show how they enable the implementation of new miniature, low cost 10 Gb/s transponders.

Keywords

assembling; automation; integrated optoelectronics; micropositioning; multichip modules; optical fibre LAN; surface mount technology; transponders; 10 Gbit/s; Ethernet standards; automated assembly; automated module manufacture; high performance optics; integrated packaging; integrated uncooled optics; micropositioning; miniature low-cost transponders; multi Gigabit line cards; optoelectronic discrete modules; optoelectronic integrated transponders; small form factor package; surface mount technology; Assembly; Ceramics; High speed optical techniques; Optical fiber devices; Optical filters; Optical receivers; Optical transmitters; Packaging; Radio frequency; Transponders;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008192

Filename

1008192