Title :
A new approach to obtain 1D thermal models for magnetic components including the effect of spacing between conductors
Author :
Escribano, L.M. ; Prieto, R. ; Oliver, J.A. ; Cobos, J.A.
Author_Institution :
Div. de Ingenieria Electronica, Univ. Politecnica de Madrid
Abstract :
Analytical (1D) thermal models for magnetic components are commonly used in the magnetic component design process in order to estimate the temperature in the component. Most of the analytical thermal models presented in the literature, consider small separation between different turns of the same layer. However, if that separation is high, a 1D thermal model might be inaccurate. This paper presents a new thermal model that is valid also for those cases. The model has been validated with several components and it has been compared with FEA results and measurements
Keywords :
conductors (electric); finite element analysis; thermal analysis; 1D thermal models; conductor spacing; finite element analysis; magnetic components; Analytical models; Conductors; Electronic packaging thermal management; Heat transfer; Isothermal processes; Magnetic analysis; Magnetic separation; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2006. APEC '06. Twenty-First Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-9547-6
DOI :
10.1109/APEC.2006.1620598
