Title :
Realization of Greedy Anti-Void Routing Protocol for Wireless Sensor Networks
Author :
Liu, Wen-Jiunn ; Feng, Kai-Ten
Author_Institution :
Dept. of Electr. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
The void problem causing the routing failure is the main challenge of the greedy routing in the wireless sensor networks. The current research work still can not fully deal with the void problem since the excessive control overheads should be consumed so as to guarantee the delivery of packets. In our previous work, a greedy anti-void routing (GAR) protocol is proposed to solve the void problem with increased routing efficiency by exploiting the boundary finding technique for the unit disk graph (UDG). The proposed rolling-ball UDG boundary traversal (RUT) is employed to completely guarantee the delivery of packets from the source to the destination node under the UDG network. However, the realization of the GAR scheme is not trivial since there can be considerable efforts required in order to realize the continuous rolling ball mechanism of the RUT scheme. In this paper, the boundary map (BM) and the indirect map searching (IMS) scheme are therefore proposed as efficient algorithms for the realization of the RUT technique. After the realization of the GAR protocol, the extensive simulations are conducted and compared with the existing localized routing algorithms. The simulation results show that the proposed GAR protocol can provide better routing efficiency.
Keywords :
boundary-value problems; routing protocols; wireless sensor networks; boundary finding; boundary map; control overheads; greedy anti-void routing protocol; indirect map searching; packet delivery; rolling-ball UDG boundary traversal; routing failure; unit disk graph; wireless sensor networks; Algorithm design and analysis; Neodymium; Network topology; Niobium; Noise measurement; Planarization; Routing protocols; Wireless communication; Wireless sensor networks;
Conference_Titel :
Global Telecommunications Conference, 2009. GLOBECOM 2009. IEEE
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-4148-8
DOI :
10.1109/GLOCOM.2009.5425945