• DocumentCode
    1695985
  • Title

    A monolithic three-axis silicon capacitive accelerometer with micro-g resolution

  • Author

    Junseok Chae ; Kulah, H. ; Najafi, K.

  • Author_Institution
    Center for Wireless Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    1
  • fYear
    2003
  • Firstpage
    81
  • Abstract
    A monolithic three-axis silicon capacitive accelerometer utilizing a combined surface and bulk micromachining technology is demonstrated with micro-g resolution. The accelerometer consists of three individual single-axis accelerometers. All three devices have full-wafer thick silicon proof-mass, large area polysilicon sense/drive electrodes, and small sensing gap (<1.5 /spl mu/m) formed by a sacrificial oxide layer. The fabricated accelerometer system is 7/spl times/9 mm/sup 2/ in size, has >5pF/g measured sensitivity and sub-/spl mu/g//spl radic/Hz mechanical noise floor for all three axes. The total measured noise floor of the accelerometer hybrid assembled with CMOS interface circuit is 1.60 /spl mu/g//spl radic/Hz, 1.08 /spl mu/g//spl radic/Hz for in-plane and out-of-plane devices, respectively.
  • Keywords
    accelerometers; elemental semiconductors; integrated circuit noise; micromachining; microsensors; monolithic integrated circuits; silicon; CMOS interface circuit; Si; mechanical noise floor; micro-g resolution; micromachining technology; oxide layer; polysilicon sense/drive electrode; sensing gap; sensitivity; silicon capacitive accelerometer; Accelerometers; Circuit noise; Crosstalk; DH-HEMTs; Electrodes; Fabrication; Micromachining; Noise measurement; Power dissipation; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1215258
  • Filename
    1215258