DocumentCode
1696016
Title
Inertial transducer design for manufacturability and performance at Motorola
Author
Hammond, J. ; McNeil, A. ; August, R. ; Koury, D.
Author_Institution
Sensor Product Div., Motorola Inc., Tempe, AZ, USA
Volume
1
fYear
2003
Firstpage
85
Abstract
Manufacturability and performance are key criteria for successful commercial MEMS products. The design of surface micro-machined z-axis capacitive transducers in particular offers challenges to achieving these criteria. These challenges include mechanical layer intrinsic stress and stress gradients (and resulting curvature), package induced deformation, and product standardization. A comparison of a prior transducer design and its present successor illustrates some solutions to these challenges. A design technique is presented that greatly reduces the effect of capacitor plate curvature on device performance. Production data concretely demonstrates the actual improvements achieved.
Keywords
capacitive sensors; capacitors; deformation; elemental semiconductors; internal stresses; microsensors; silicon; MEMS; Motorola; Si; capacitor plate curvature; deformation; manufacturability; mechanical layer intrinsic stress; package; surface micromachined capacitive transducers; transducer designing; Accelerometers; Capacitive sensors; Capacitors; Compressive stress; Micromechanical devices; Packaging; Production; Semiconductor device manufacture; Tensile stress; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1215259
Filename
1215259
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