Modeling and characterization of wire bonding for RF applications

Author

Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Low, Lee A. ; Ke, Fei X. ; Yip, Kok C. ; Lim, Yak P.

Author_Institution

Electron. Packaging Dept., Gintic Inst. of Manuf. Technol., Singapore, Singapore

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

905

Lastpage

909

Abstract

This paper describes a design methodology for improving the electrical performance of wire bonding. Adjacent power or ground wires are used to provide return paths in a coplanar configuration, thereby minimizing impedance mismatch. Design space exploration based on full-wave electromagnetic analysis is performed to achieve an optimized topology. The methodology has been demonstrated for both parallel and fanout bonding topologies for high frequencies up to 10 GHz. With advances in wire bonding technology, particularly fine pitch bonding, a coplanar configuration is highly feasible. The proposed methodology can be applied to lead frame, leadless chip carrier, COB and advanced BGA packages.

Keywords

ball grid arrays; circuit simulation; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; lead bonding; losses; 10 GHz; BGA packages; COB; IC packaging; coplanar configuration; electrical performance; fanout bonding; fine pitch bonding; ground wires; impedance mismatch; insertion losses; lead frame; leadless chip carrier; optimized topology; return losses; up to 10 GHz; wire bonding; Bonding; Design methodology; Design optimization; Electromagnetic analysis; Impedance; Radio frequency; Space exploration; Space technology; Topology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008207

Filename

1008207