Title :
Silicon electroosmotic micropumps for integrated circuit thermal management
Author :
Laser, D.J. ; Myers, A.M. ; Shuhuai Yao ; Bell, K.F. ; Goodson, K.E. ; Santiago, J.G. ; Kenny, T.W.
Author_Institution :
Dept. of Mech. Eng., Stanford Univ., CA, USA
Abstract :
We are developing a class of electroosmotic micropumps fabricated from silicon substrates that can be used for integrated circuit thermal management applications. Prototype micropumps with 0.15 cm/sup 3/ packages produce a maximum flow rate of 170 /spl mu/L min/sup -1/ and a maximum pressure of 10 kPa operating at 400 V. These specifications approach the requirements for single-phase forced-convective cooling of small IC hot spots. The micropumps operate on less than 200 mW and, having no moving structural elements, offer inherent reliability advantages. The impact on pump performance of geometry, surface treatment, and choice of working fluid has been characterized.
Keywords :
elemental semiconductors; integrated circuit packaging; microfluidics; micropumps; monolithic integrated circuits; reliability; semiconductor device models; silicon; thermal management (packaging); 10 kPa; 200 mW; 400 V; IC hot spots; Si; flow rate; integrated circuit thermal management; prototype micropumps; reliability; silicon electroosmotic micropumps fabrication; silicon substrates; single-phase forced-convective cooling; surface treatment; working fluid; Application specific integrated circuits; Cooling; Geometry; Integrated circuit packaging; Micropumps; Prototypes; Pumps; Silicon; Surface treatment; Thermal management;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215275
