Title :
The numerical simulation of the heat-transfer processes in the silicon heat flow sensor
Author :
Dikareva, R.P. ; Grinev, V.V. ; Kuralin, E.A. ; Cherenko, V.A.
Author_Institution :
Novosibirsk State Tech. Univ., Russia
fDate :
6/21/1905 12:00:00 AM
Abstract :
The authors use finite element analysis to model two types of Si heat flow sensors, i.e. membrane- and plate-type sensors. Numerical simulation of heat transfer processes in the sensors is performed
Keywords :
electric sensing devices; elemental semiconductors; heat transfer; semiconductor device models; silicon; temperature sensors; Si; finite element analysis; heat flow sensor; heat-transfer; membrane-type sensors; numerical simulation; plate-type sensors; Equations; Finite difference methods; Finite element methods; Linearity; Numerical simulation; Sensor phenomena and characterization; Silicon; Solid modeling; Temperature distribution; Thermal sensors;
Conference_Titel :
High Power Microwave Electronics: Measurements, Identification, Applications, 1999. MIA-ME '99. Proceedings of the IEEE-Russia Conference
Conference_Location :
Novosibirsk
Print_ISBN :
5-7782-0270-9
DOI :
10.1109/MIAME.1999.827844
