DocumentCode :
1696596
Title :
Mechanical reliability of epipoly MEMS structures under shock load
Author :
Wagner, U. ; Muller-Fiedler, R. ; Bagdahn, J. ; Michel, B. ; Paul, O.
Author_Institution :
Corp. Res. & Dev., Robert Bosch GmbH, Stuttgart, Germany
Volume :
1
fYear :
2003
Firstpage :
175
Abstract :
The design, fabrication and characterization of epi-polysilicon test structures for dynamic tensile tests under shock loads ranging from 2,500 g to 30,000 g are reported. In accordance with published data for static fracture strength, their dynamic failure rate obeys a Weibull distribution model. The fracture surfaces suggest that failure criteria based on maximum principal stress are effective. Stresses resulting from shock load were obtained using finite element simulations. It was shown that even slight deviations from optimum loading conditions (i.e., out-of-plane components) can considerably increase the maximum experienced stress. Therefore, the usage of simplistic models to estimate maximum stress levels from shock loads is greatly discouraged. An out-of-plane component was identified in the experimental setup used. Based on an assessment of the magnitude of deviation, the failure stresses are estimated to fall below the quasi-static fracture strength by ca. 50%.
Keywords :
Weibull distribution; elemental semiconductors; failure analysis; finite element analysis; fracture toughness; internal stresses; micromechanical devices; reliability; silicon; tensile testing; Weibull distribution model; dynamic failure rate; dynamic tensile tests; epipoly MEMS structures; epipolysilicon test structures; failure criteria; failure stress; finite element simulation; fracture surface; mechanical reliability; quasistatic fracture strength; shock load; static fracture strength; stress levels; Electric shock; Fabrication; Finite element methods; Laboratories; Materials testing; Micromechanical devices; Research and development; Scanning electron microscopy; Surface cracks; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
Type :
conf
DOI :
10.1109/SENSOR.2003.1215281
Filename :
1215281
Link To Document :
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