• DocumentCode
    1696823
  • Title

    GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises

  • Author

    Kam, Dong Gun ; Lee, Heeseok ; Baek, Seungyong ; Park, Bongcheol ; Kim, Joungho

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    1058
  • Lastpage
    1065
  • Abstract
    The concept of twisted pair on the cable interconnection can be readily applied to the differential lines on printed circuit board (PCB), which enables enhanced immunity against crosstalk and radiated emission. In this paper, twisted differential line (TDL) is implemented on PCB and fully characterized. First, the transmission characteristics of TDL including propagation constant and differential impedance are extracted by using 3D full-wave analysis. The potential of TDL for the transmission of over GHz signal and enhanced immunity against crosstalk and radiated emission is clearly shown. Second, the measurement results reconfirm TDL´s capability as a good transmission line structure over several GHz. Also, it is modeled by a simple equivalent circuit, based on measurement results. Third, the enhanced immunity of TDL against crosstalk and radiated emission is clearly demonstrated by measurement results. TDL is compared with other transmission line structures showing its superiority. Finally, several ideas to improve TDL´s performance are suggested and verified to be useful.
  • Keywords
    circuit noise; crosstalk; electromagnetic interference; equivalent circuits; printed circuits; twisted pair cables; 3D full-wave analysis; EMI; cable interconnection; crosstalk noise; differential impedance; equivalent circuit model; printed circuit board; propagation constant; radiated emission; transmission line; twisted differential line; twisted pair; Crosstalk; Distributed parameter circuits; Electromagnetic interference; Equivalent circuits; Impedance; Integrated circuit interconnections; Power cables; Printed circuits; Propagation constant; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008233
  • Filename
    1008233