Title :
High-temperature, high-density packaging of a 60kW converter for >200°C embedded operation
Author :
Hopkins, D.C. ; Kellerman, D.W. ; Wunderlich, R.A. ; Basaran, C. ; Gomez, J.
Author_Institution :
Buffalo Univ., NY, USA
Abstract :
This paper describes the design of a 60kW, actuator motor drive using high temperature SiC devices. Power JFET devices are selected for high-frequency performance and high density. High-density packaging uses an aluminum conductor, AlN substrate and AlSiC combination to minimize dissimilar interfaces. The forced air-cooled design provides >1.1kW/cu.in.
Keywords :
III-V semiconductors; aluminium compounds; electronics packaging; high-temperature electronics; junction gate field effect transistors; motor drives; power convertors; power field effect transistors; silicon compounds; wide band gap semiconductors; 60 kW; AlN substrate; AlN-Al; AlSiC; AlSiC combination; actuator motor drive; aluminum conductor; forced air-cooled design; high-density packaging; high-temperature SiC device; power JFET device; power converter; Actuators; Contracts; Low voltage; Motor drives; Packaging; Power distribution; Power electronics; Power system reliability; Silicon carbide; Temperature;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2006. APEC '06. Twenty-First Annual IEEE
Print_ISBN :
0-7803-9547-6
DOI :
10.1109/APEC.2006.1620641
