A low cost COTS-based microwave packaging methodology

Lockheed Martin Naval Electronics & Surveillance Systems - Surface Systems (LM NE&SS-SS) developed a unique multichip module (MCM) packaging system designed to support low cost manufacturing of electronics for advanced defense and commercial applications. This technology, plastic chip-on-flex (PCOF), is based on the baseline high density interconnect (HDI) technology, invented by General Electric Aerospace (now Lockheed Martin) and perfected as a result of on-going collaboration between Lockheed Martin (LM) and GE. The Lockheed Martin PCOF technology is a key element in reducing costs of microelectronic modules. The HDI interconnect structure is rugged (no wirebonds) and can be designed with controlled impedance transmission lines for sensitive RF interconnections. HDI technology makes it possible to design and manufacture microelectronic modules which are smaller, lighter weight, highly integrated, highly reliable, with predictable/reproducible electrical performance. This paper emphasises several novel aspects of the technology. Benefits include reduced manufacturing cost, increased reliability, and reduced module size and weight.