DocumentCode
1697239
Title
Conductivity improvement of thermoplastic isotropically conductive adhesive
Author
Liong, S. ; Wong, C.P. ; Burgoyne, W.F., Jr.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1140
Lastpage
1146
Abstract
Electrically conductive adhesives (ECA) generally comprise of a thermosetting polymer and conductive filler. In this study, a thermoplastic polymer is used in isotropically conductive adhesive (ICA). The thermoplastic polymer is polyarylene ether (PAE-2), which has extremely low moisture absorption (0.279wt%). In thermoplastic ICA, drying (solvent evaporation) is the step when the conductive paths are established. In this study, it was shown that the drying process is critical for optimizing the properties of the ICA. To maximize the effectiveness of the drying process, the glass transition temperature (Tg) of the polymer was adjusted using a plasticizer. The bulk resistivity of ICA samples with plasticizer was three orders of magnitude lower than the sample without it. TGA data confirmed the improvement in drying efficiency of ICA with the use of plasticizer. An unexpected result is that the bulk resistivity and contact resistance showed an increasing trend with aging time. The polar nature of the plasticizer molecule increased the moisture uptake of the thermoplastic, but at the same time helped to improve the adhesion strength of the polymer. Plasticizer is a promising additive in thermoplastic ICA, but it must be compatible with the polymer, so that it does not negatively affect the overall properties of ICA.
Keywords
adhesion; adhesives; ageing; conducting materials; contact resistance; drying; electrical conductivity; electrical resistivity; filled polymers; glass transition; moisture; adhesion strength; aging; bulk resistivity; conductive filler; contact resistance; drying process; electrical conductivity; electrically conductive adhesive; glass transition temperature; isotropically conductive adhesive; moisture absorption; plasticizer; polyarylene ether; solvent evaporation; thermoplastic polymer; Absorption; Conductive adhesives; Conductivity; Contact resistance; Glass; Independent component analysis; Moisture; Polymers; Solvents; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008247
Filename
1008247
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