A low-cost CMOS compatible serpentine-structured polysilicon-based microbolometer array

Author

Socher, E. ; Sinai, Y. ; Nemirovsky, Y.

Author_Institution

Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel

Volume

1

fYear

2003

Firstpage

320

Abstract

This work reports the design, fabrication and initial characterization of novel low-cost CMOS compatible microbolometers and a 16/spl times/16 demonstration focal plane array based on the new technology. The bolometers are fabricated as part of a standard CMOS process with maskless postprocessing that includes frontside isotropic silicon dry etching in order to release the serpentine microstructures of the bolometers. FPA readout is based on differential current integration per column with an internal 5bit DAC for non-uniformity correction of each pixel. Fabricated devices are measured and compared with design and simulation.

Keywords

CMOS image sensors; bolometers; elemental semiconductors; etching; focal planes; integrated circuit technology; readout electronics; silicon; CMOS compatible microbolometers; Si; differential current integration; focal plane array; isotropic silicon dry etching; maskless postprocessing; serpentine microstructures; Bolometers; CMOS process; Circuits; Dielectrics; Fabrication; Resistors; Sensor arrays; Silicon; Thermal resistance; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1215317

Filename

1215317