Title :
Investigation of energy loss mechanisms in micromechanical resonators
Author :
Candler, R.N. ; Li, H. ; Lutz, M. ; Park, W.-T. ; Partridge, A. ; Yama, Gary ; Kenny, T.W.
Author_Institution :
Dept. of Electr. & Mech. Eng., Stanford Univ., CA, USA
Abstract :
Micromechanical resonators with resonant frequencies from 500 kHz to 10 MHz were built and examined for several energy loss mechanisms. Thermoelastic damping, clamping loss and air damping were considered. The devices were shown to be limited by thermoelastic damping, providing experimental verification of this phenomenon at the microscale. Resonators with scaled dimensions also matched well with scaling theory of damping at a given pressure. An energy loss mechanism other than thermoelastic dissipation, most likely clamping loss, was shown to be dominant for resonators whose ratio of length to width was less than 10:1. The devices were fabricated using a single-wafer encapsulation process.
Keywords :
damping; encapsulation; micromechanical resonators; thermoelasticity; 500 kHz to 10 MHz; air damping; clamping loss; energy loss mechanisms; micromechanical resonators; resonant frequency; single-wafer encapsulation process; thermoelastic damping; thermoelastic dissipation; Clamps; Damping; Encapsulation; Energy loss; Micromechanical devices; Resonant frequency; Seals; Temperature; Thermal resistance; Thermoelasticity;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215320