Title :
Low-loss RF MEMS metal-to-metal contact switch with CSP structure
Author :
Seki, T. ; Sato, Seiki ; Masuda, T. ; Kimura, I. ; Imanaka, K.
Author_Institution :
Central R&D Lab., Omron Corp., Kyoto, Japan
Abstract :
We reported a novel RF-MEMS switch with an extremely low insertion loss of-0.5 dB and a high isolation of-30 dB up to 10 GHz. The switch was fabricated ultra compact size of 1.8/spl times/1.8/spl times/1.0 mm/sup 3/ with Chip Scale Packaging (CSP) structure utilizing wafer level packaging technology. The wafer level packaging with frit glass makes it possible to mount the device directly on the circuit board without any extra outer package and bonding of wires, which deteriorate the RF characteristics. The package is made from cavitied glass wafer as cap-material and frit glass as seal-material. The device wafer consists of single crystal silicon actuators, a base glass substrate and a cap glass.
Keywords :
chip scale packaging; microswitches; 1.0 mm; 1.8 mm; 10 GHz; CSP structure; chip scale packaging; low insertion loss; low-loss RF MEMS metal-metal contact switch; microelectromechanical system; wafer level packaging technology; Chip scale packaging; Contacts; Glass; Insertion loss; Isolation technology; Printed circuits; Radiofrequency microelectromechanical systems; Switches; Wafer bonding; Wafer scale integration;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215322
