Title :
Packaging test chip for flip-chip and wire bonding process characterization
Author :
Schwizer, J. ; Wan Ho Song ; Mayer, M. ; Brand, O. ; Baltes, H.
Author_Institution :
Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
This paper reports on the latest member of a test chip family for packaging process characterization, containing a novel flip-chip microsensor that can measure forces in all three directions, acting on each of its solder balls. The large temperature range (-40 /spl deg/C to 125 /spl deg/C) places high demand on sensor stability. Various sources for sensor offset and offset drift are identified. Applications include thermal cycling experiments of the flip-chip and detection of physical processes during wire bonding. For Au-Al bond contacts, a quality parameter can be extracted from the sensor signal.
Keywords :
aluminium; chip scale packaging; flip-chip devices; gold; lead bonding; microsensors; solders; -40 to 125 degC; Au-Al; Au-Al bond contact; flip-chip microsensor; packaging test chip; solder ball; thermal cycling; wire bonding; Bonding processes; Force measurement; Microsensors; Packaging; Semiconductor device measurement; Sensor phenomena and characterization; Temperature distribution; Temperature sensors; Testing; Wire;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1215348
