Elevated temperature tensile/creep test of UV-LIGA nickel thin film for design of high-density micro connector

Author

Isono, Y. ; Tada, J. ; Watanabe, Toshio ; Unno, T. ; Toriyama, T. ; Sugiyama, S.

Author_Institution

Dept. of Mech. Eng., Ritsumeikan Univ., Shiga, Japan

Volume

1

fYear

2003

Firstpage

456

Abstract

This paper describes mechanical properties of UV-LIGA Ni films at elevated temperatures for design of a high-density micro connector. A compact tensile tester operated under a scanning probe microscope (SPM) was newly developed, and it characterized a stress-strain relation and creep behavior of the Ni films at temperatures ranging from 300 K to 573 K. 600 /spl mu/m-long, 15 /spl mu/m-thick and 50 /spl mu/m-wide Ni specimens were fabricated by UV-LIGA process with a thick photoresist. This research proposed an inelastic constitutive equation of UV-LIGA Ni films for an optimum design of micro connector by finite element analyses.

Keywords

LIGA; creep testing; finite element analysis; metallic thin films; micromechanical devices; nickel; scanning probe microscopy; stress-strain relations; tensile testing; ultraviolet radiation effects; 15 micron; 300 to 573 K; 50 micron; 600 micron; Ni; Ni films; SPM; UV-LIGA nickel thin film; creep test; finite element analyses; high density micro connector; inelastic constitutive equation; mechanical properties; photoresist; scanning probe microscopy; stress-strain relation; tensile test; Connectors; Creep; Equations; Mechanical factors; Nickel; Resists; Scanning probe microscopy; Temperature distribution; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1215352

Filename

1215352