DocumentCode
1698617
Title
Alternative bumping processes for DRAM-CSP
Author
Biedorf, Rolf ; Heinze, Roland ; Wollanke, Alexander ; Wolter, Klaus ; Zerna, Thomas ; Plötzke, Andreas
Author_Institution
Electron. Technol. Lab., Dresden Univ. of Technol., Germany
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1460
Lastpage
1468
Abstract
The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That´s why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.
Keywords
assembling; circuit optimisation; printed circuit manufacture; printing; reflow soldering; surface mount technology; DRAM-CSP; assembly; bumping optimisation; bumping processes; interposer; multiple step process; pitch; pre-formed solder balls; printed circuit boards; reflow soldering step; screen printing; solder paste; Apertures; Assembly; Bonding; Electronic components; Laboratories; Manufacturing; Printed circuits; Printing; Productivity; Reflow soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008299
Filename
1008299
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