Title :
Electronics packaging - a Web-based course for the IEEE community
Author :
Caggiano, Michael F. ; Ho, Ka M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
The authors profile a course that is a Web-based enhancement of a new graduate. course entitled "Electronics Packaging" that was developed and introduced into the ECE Department at Rutgers University during the spring of 2001. This new course deals with the electrical characterization and modeling of the parasitics for integrated circuit packaging. The course is targeted to the electrical engineering graduate population of full-time students and industry part-time graduate students that have a background in circuit analysis. The authors discuss the status of the course and demonstrate a sample of the Web designed lectures related to the electrical parasitics of the package.
Keywords :
Internet; computer aided instruction; educational courses; electronic engineering computing; electronic engineering education; integrated circuit packaging; IC packaging course; IEEE Community; Rutgers University; Web-based course; electrical characterization; electrical engineering graduates; electronics packaging course; graduate course; integrated circuit packaging; microelectronic packaging; parasitics modeling; Capacitance; Circuit synthesis; Costs; Electronic packaging thermal management; Electronics packaging; Inductance; Integrated circuit modeling; Integrated circuit packaging; Springs; Very high speed integrated circuits;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008307
