DocumentCode
1698903
Title
A multimedia course for the design of microsystem packages
Author
Illyefalvi-Vitéz, Zsolt ; Ruszinkó, Miklós ; Codreanu, Norocel-Dragos ; Hertel, Lóránt ; Bojta, Péter
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1534
Lastpage
1538
Abstract
Teaching the design of microsystem packages is one of the most important topics in the BSc and MSc level university education of electronic engineering. Special emphasis should be laid on teaching design, according to the general opinion that industrial companies are suffering from a shortage of design engineering staff. In addition to providing courses on CAD design in regular university curricula, courses and training should be developed and provided for industrial engineers. The aim of such courses is to bridge the gap between the knowledge that is provided by the different undergraduate modules and that which is necessary and relevant for the industrial labor market and/or requested by the graduate educational modules for further qualification. Internet accessible, interactive, multimedia equipped, distant learning virtual laboratory experiments have to be offered for exploratory training to improve the knowledge of industrial engineers. The present paper reviews a part of a course that tries to meet these requirements.
Keywords
circuit CAD; computer aided instruction; distance learning; educational courses; electronic engineering education; integrated circuit packaging; micromechanical devices; multimedia systems; CAD design; Internet accessibility; distant learning virtual laboratory experiments; industrial engineers; interactive course; microsystem package design; multimedia course; university electronic engineering education; Bridges; Consumer electronics; Design automation; Design engineering; Education; Electronics packaging; Industrial training; Internet; Laboratories; Qualifications;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008311
Filename
1008311
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