Anodic bonding of optical fibers to silicon for integrating MEMS based optical pressure and temperature sensors onto optical fibers

In this paper we present novel anodic bonding of optical fibers to silicon wafers of conventional thickness. In this technique we use an ultra-thin silicon layer as an intermediate stress reducing layer. Anodic bonding of optical fibers to silicon enables integration of optical pressure sensors and temperature sensors for harsh and biomedical environments onto optical fibers by non-adhesive means. Non-adhesive integration of MEMS sensors onto optical fibers will lead to creation of new class of devices. Results include tensile bond strength test that indicate maximum average tensile strength of the fiber-to-thick silicon bonds is 4.29 MPa corresponding to bonding at 400/spl deg/C and ANSYS simulation which verify the role of ultra thin silicon as a stress reducing layer.