• DocumentCode
    1699286
  • Title

    Hot spot measurement on CMOS-based image sensor using liquid crystal thermograph

  • Author

    Jeong Park ; Richman, S. ; Chen, Fan ; Mooney, James ; Escobar, Diego ; Sato, Daisuke ; Lee, C.C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    1627
  • Lastpage
    1630
  • Abstract
    CMOS-based (Complementary metal-oxide semiconductor) imager technology offers the opportunity for large scale (1 megapixel and greater) image capture using substantially lower power consumption than conventional imaging sensors such as CCD´s (Charge Coupled Device). In addition, CMOS-based image sensors provide the advantages of greater on-chip integration of features and reduced system cost. Such devices are excellent candidates for many consumer imaging applications including digital still cameras, video cameras, and cellular phones with imagers. Typically, any final product using a CMOS-based image sensor will possess myriad additional components each of which may produce heating of the entire system. Increased system temperature arising from dense circuitry can lead to degradation of image quality as the sensor itself heats up. An investigation of the thermal profile of a CMOS image sensor will provide useful information for device design and optimization. In this paper, we present thermographs of CMOS imager sensors produced by a technique using a nematic liquid crystal.
  • Keywords
    CMOS image sensors; infrared imaging; nematic liquid crystals; temperature distribution; temperature measurement; CMOS-based image sensor; hot spot measurement; image quality; image sensor thermal profile; liquid crystal thermograph; nematic liquid crystal; sensor heating; system temperature; CMOS image sensors; CMOS technology; Charge-coupled image sensors; Digital cameras; Image sensors; Large-scale systems; Liquid crystals; MOS devices; Temperature sensors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008325
  • Filename
    1008325