DocumentCode
1699286
Title
Hot spot measurement on CMOS-based image sensor using liquid crystal thermograph
Author
Jeong Park ; Richman, S. ; Chen, Fan ; Mooney, James ; Escobar, Diego ; Sato, Daisuke ; Lee, C.C.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1627
Lastpage
1630
Abstract
CMOS-based (Complementary metal-oxide semiconductor) imager technology offers the opportunity for large scale (1 megapixel and greater) image capture using substantially lower power consumption than conventional imaging sensors such as CCD´s (Charge Coupled Device). In addition, CMOS-based image sensors provide the advantages of greater on-chip integration of features and reduced system cost. Such devices are excellent candidates for many consumer imaging applications including digital still cameras, video cameras, and cellular phones with imagers. Typically, any final product using a CMOS-based image sensor will possess myriad additional components each of which may produce heating of the entire system. Increased system temperature arising from dense circuitry can lead to degradation of image quality as the sensor itself heats up. An investigation of the thermal profile of a CMOS image sensor will provide useful information for device design and optimization. In this paper, we present thermographs of CMOS imager sensors produced by a technique using a nematic liquid crystal.
Keywords
CMOS image sensors; infrared imaging; nematic liquid crystals; temperature distribution; temperature measurement; CMOS-based image sensor; hot spot measurement; image quality; image sensor thermal profile; liquid crystal thermograph; nematic liquid crystal; sensor heating; system temperature; CMOS image sensors; CMOS technology; Charge-coupled image sensors; Digital cameras; Image sensors; Large-scale systems; Liquid crystals; MOS devices; Temperature sensors; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008325
Filename
1008325
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