DocumentCode
1699492
Title
Optocoupler BGA package
Author
Joshi, R. ; Wu, Chung-Lin ; Narayanan, M.
Author_Institution
Fairchild Semicond. Corp., San Jose, CA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1680
Lastpage
1682
Abstract
The article presents the design of an optocoupler BGA. A low profile miniature surface mount component is described up to 1.20 mm in height having a footprint smaller than the current PDIP form factors. The optocoupler BGA does not need encapsulation (mold compounds) and its manufacturing tooling is form factor independent. Its design also lends itself to improved reliability performance in accelerated tests such as thermal cycling. Using Pb-free solder balls an all Pb-free package can be constructed.
Keywords
ball grid arrays; life testing; opto-isolators; reliability; soldering; surface mount technology; 1.20 mm; Pb-free solder ball; accelerated testing; manufacturing process; optocoupler BGA package; reliability; surface mount component; thermal cycling; Electronic components; Electronic packaging thermal management; Electronics packaging; Electrons; Integrated circuit packaging; Light emitting diodes; Manufacturing; Photodetectors; Phototransistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008334
Filename
1008334
Link To Document