• DocumentCode
    1699665
  • Title

    Minimization of splice loss between a single mode fiber and an erbium doped fiber

  • Author

    Pradhan, Salil ; Mazloom, Amir ; Arbulich, John ; Srihari, K.

  • Author_Institution
    Electron. Manuf. Res. & Services, State Univ. of New York, Binghamton, NY, USA
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    1729
  • Lastpage
    1734
  • Abstract
    An EDFA involves the use of Single Mode Fibers (SMFs) and Erbium Doped Fibers (EDFs). Studies have indicated that the splicing of an SMF to another SMF is less sensitive to fusion splicing parameters, if they are selected within an appropriate range. However, splicing of dissimilar fibers such as an SMF to an EDF poses a new set of requirements on the splicing specifications. Due to the variation in physical properties of the two fibers, the splice loss between them is much higher compared with that between SMF-SMF. The objective of this research endeavor was to develop a systematic procedure to minimize the losses between an EDF and an SMF. Relevant splicing parameters were identified through statistically designed experiments. Significant parameters were screened out and their interactions studied. The experimental results are discussed. Through this research effort, a systematic procedure for evaluating an EDF and identifying the parameters that could be used for a specific batch of fibers was developed. Guidelines for the characterization process are also discussed.
  • Keywords
    design of experiments; erbium; optical fibre amplifiers; optical fibre fabrication; optical fibre losses; optical fibre testing; Er doped fiber; Er doped fiber amplifiers; characterization process guidelines; dissimilar fiber splicing; fusion splicing parameters; screening experiment; single mode fiber; splice loss minimization; statistically designed experiments; Assembly; Erbium; Manufacturing; Medical services; Optical attenuators; Optical fiber devices; Optical fiber networks; Optical losses; Optical receivers; Splicing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008343
  • Filename
    1008343