Title :
Solder joint shape and standoff height prediction and integration with FEA-based methodology for reliability evaluation
Author :
Sidharth ; Blish, Richard ; Natekar, Devendra
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
Solder joint fatigue failure is a common failure mechanism in semiconductor packages mounted on boards. The thermal expansion mismatch between the package and the board causes cyclic loading on the solder joints during temperature cycling. It is therefore important to model the solder joint shape and standoff height accurately to estimate the reliability of a solder joint assembly. This paper discusses details of solder shape prediction using the Surface Evolver tool and its validation with experimental data. A comparison with truncated sphere model is also provided. A strategy for importing Surface Evolver data into a finite element based reliability evaluation is outlined.
Keywords :
circuit reliability; convergence of numerical methods; electronic engineering computing; fatigue; finite element analysis; packaging; printed circuits; soldering; ANSYS based FEA module; FEA-based methodology; Surface Evolver tool; board-mounted semiconductor packages; convergence; failure mechanism; finite element based reliability evaluation; reliability evaluation; solder joint assembly reliability; solder joint fatigue failure; solder joint shape prediction; solder joint standoff height prediction; temperature cycling; thermal expansion mismatch; truncated sphere model; Assembly; Failure analysis; Fatigue; Finite element methods; Semiconductor device packaging; Shape; Soldering; Temperature; Thermal expansion; Thermal loading;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008345
