Title :
An adaptable, high performance LGA connector technology
Author :
Brown, Dirk D. ; Hong, Sangjin ; Fan, Zhineng ; Williams, John D. ; Li, Che-Yu
Author_Institution :
HCD Inc., Sunnyvale, CA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
A new land grid array (LGA) connector technology is presented that resolves many of the limitations of current LGA connector approaches. A novel design is used to produce Cu-alloy springs supported in a fully cross-linked polymer ´button´. This button acts as a reliable, high-frequency, low-profile connector element capable of handling high current densities. In addition, the mechanical and electrical properties of the button can be engineered to meet specific application requirements, for example low contact force for a large array, as demonstrated through modeling and experimental data.
Keywords :
arrays; circuit reliability; copper; electric connectors; mechanical properties; packaging; polymers; printed circuit accessories; Cu; Cu-alloy springs; LGA connector technology; PCB/package connector; cross-linked polymer button; electrical properties; high current densities; high-frequency connector element; land grid array connector technology; large array; low contact force; low-profile connector element; mechanical properties; modeling; Conductivity; Connectors; Contacts; Costs; Injection molding; Packaging; Polymers; Sockets; Springs; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008352
