2004 IEEE International Conference on Semiconductor Electronics (IEEE Cat. No.04EX917C)

fYear

2004

Abstract

The following topics are dealt with: low k dielectrics; ohmic contacts; condenser microphones; capacitors; low temperature bonding; MOS structures; VHDL-AMS; NMOSFET devices; Schottky diode sensors; CMOS circuits; electrostatic discharge; BiCMOS dynamic circuits; galvanic corrosion elimination; multichip bondpads; Auger electron spectroscopy; epitaxial wafers; wafer fabrication; heterojunction bipolar transistors; logic circuits; quantum well photodetectors; SRAM cells; semiconductor device modeling; MEMS devices; inductors; neural network microchips; optical receiver integrated circuit; power amplifiers; semiconductor testing; magnetotransistor; semiconductor lasers; microsensors; logic design; image encryption; integrated circuit testing; optical waveguides and HEMT.

Keywords

Auger electron spectroscopy; BiCMOS integrated circuits; CMOS integrated circuits; MIS structures; MOSFET; SRAM chips; Schottky diodes; capacitors; corrosion; cryptography; hardware description languages; heterojunction bipolar transistors; high electron mobility transistors; image processing; inductors; integrated circuit testing; integrated optoelectronics; logic circuits; logic design; low-k dielectric thin films; low-temperature techniques; micromechanical devices; microphones; neural nets; ohmic contacts; optical receivers; optical waveguides; photodetectors; power amplifiers; quantum well devices; semiconductor device models; semiconductor lasers; wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on

Conference_Location

Kuala Lumpur

Print_ISBN

0-7803-8658-2

Type

conf

DOI

10.1109/SMELEC.2004.1620816

Filename

1620816