DocumentCode
1701576
Title
Modeling of diaphragms for micromachined condenser microphones
Author
Ganji, Bahram Azizollah ; Majlis, Burhanuddin Yeop
Author_Institution
MEMS Lab. Inst. of Microengineering & Nanoelectronics, Univ. Kebangsaan Malaysia, Selangor, Malaysia
fYear
2004
Abstract
We present and compare the different kinds of diaphragms for micromachined condenser microphones. The aim is to develop the microphones with high sensitivity. For micromachining diaphragm, there is significant internal (residual) stress, which strongly decreases the mechanical sensitivity of diaphragm. An analysis was performed using the MATLAB software. According to our calculations, a corrugated diaphragm can greatly increase the mechanical sensitivity of the microphone diaphragms due to the reduction of the initial stress effect without changing the process conditions. A planar diaphragm is more rigid than a corrugated diaphragm at either small and large deflections (or pressures) when both diaphragms have same level of initial stress. Flat diaphragms show a nonlinear relation between the deflection and the applied pressure. The nonlinearity is caused by stress due to stretching of the diaphragm. It has been shown that corrugated diaphragms have a larger linear range than flat diaphragms, because of the achieved reduction of the initial stress in the diaphragm.
Keywords
diaphragms; internal stresses; micromachining; micromechanical devices; microphones; stress effects; MEMS devices; condenser microphones; corrugated diaphragm; diaphragm modeling; flat diaphragms; initial stress effect; internal stress; mechanical sensitivity; micromachining process; microphone diaphragms; planar diaphragm; Internal stresses; Laboratories; Mathematical model; Micromachining; Micromechanical devices; Microphones; Nanoelectronics; Performance analysis; Residual stresses; Silicon; MEMS; condenser microphone; flat and corrugated diaphragms; initial stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN
0-7803-8658-2
Type
conf
DOI
10.1109/SMELEC.2004.1620829
Filename
1620829
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