• DocumentCode
    1701654
  • Title

    Impact of Transistor Level degradation on product reliability

  • Author

    Nigam, Tanya

  • Author_Institution
    GLOBALFOUNDRIES, Sunnyvale, CA, USA
  • fYear
    2009
  • Firstpage
    431
  • Lastpage
    438
  • Abstract
    Product level lifetime margins, determined by HCI and BTI, are shrinking with scaling. Accurate device-level HCI degradation models, together with known BTI models, are needed to predict frequency degradation of a ring oscillator. Both NBTI and HCI exhibit relief during AC operation and the respective contribution to RO frequency degradation is a function of applied bias.
  • Keywords
    hot carriers; oscillators; semiconductor device reliability; BTI; HCI; RO frequency degradation; bias temperature instability; hot carrier injection; product level lifetime margins; product reliability; ring oscillator; transistor level degradation; Degradation; Frequency; Human computer interaction; Niobium compounds; Predictive models; Ring oscillators; Titanium compounds; Transistors; HCI; NBTI; product degradation; ring oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280815
  • Filename
    5280815